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Pitch Changing Back-to Back

Description
  • PCB-x00

    • Transfers 24 to 26 wafers between one standard pitch plastic cassette and one custom process boat in a contact back-to-back configuration.
    • Configurable to accommodate a wide range of Plastic, Teflon®, Metal, Quartz, Silicon Carbide, and Polysilicon carriers.
    • Machine interface is a 12 key pad with a 4 line LCD Display.
    • Designed to limit particle contamination by using lead screw drive and stepper motor, “clean room grade” rails and bearings and electric boat sensors.
    • All aluminum parts are hard black anodized for corrosion resistance.
    • Electronic through beam sensors are used to detect wafer presence in boats and retainers thus preventing accidental double loading and scratches.
    • Lift system uses ramped speed controls for gentle pick-up and landing.
    • Pressure sensors are used for both personal safety and machine safety by inhibiting machine operation.
    • Machine will not drop wafers in the event of a power failure and will prompt the operator through the “Recovery Mode” after power has been restored.
    • A “Technician Mode” is provided to facilitate preventative maintenance.